Dear Technetters hello
We are facing some problem of BGA soldering, actually we are using the oval
shape pad on PCB for  BGA  This is for better analysis to  find the open
joints in X ray inspection M/c. The problem is in between the Tin plated and
the gold plated pad for same type PCB .  if we reflow both type of PCB at
same Profile then we find the tin plated PCB has much more oval shaped
joint then gold plated. Can any body tell me the basic deference about the
wetting or molten solder flow  on  gold plated and the tin plated Pads.

With regards
Pankaj Karnwal
QualityAssurance Ext.211
BESL A-4,Sec-5 NOIDA,201301,INDIA
e mail : <mailto:[log in to unmask]>
Barco,innovators in image processing

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