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December 2002

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Subject:
From:
Tom Gervascio <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 26 Dec 2002 11:22:52 -0500
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text/plain (41 lines)
bake the boards out of  moisture/volatiles- probably more of an issue
with wave than reflow solder

>>> [log in to unmask] 12/26/02 08:15AM >>>
Hello All,

What treatment should be given for flex boards prior to the reflow
process?

Thanks,
Marki Sasportas.

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