Alejandro,

Being a PCB Designer I look at things a little different. The foot print may need some tweaking. What the pads are attached to (traces or copper pours) can have a big effect, too. How they approach the reflow machine could have an effect. You might want to try some of these things if changing your paste or set-up doesn't do anything.

Some components you just don't want to go on the bottom of a PCB as it goes through a solder wave. The 1206 is a component that can. That's all that the note means. In other words, it's acceptable for wave as well as reflow. However, the pattern for wave and reflow are different.



Allen Maddox
Sr. PC Board Designer
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www.gai-tronics.com
610-796-5854   Voice
610-777-1870   Fax

>>> Becerra Alejandro <[log in to unmask]> 12/02/02 08:23PM >>>
Hello to All,

We have had tombstoning in a Film Chip Capacitor (Size 1206).
It is being soldered in a normal reflow process, and this is the only
component that it is showing tombstoning.
Reviewing the specs. of the component in the web I found that this capacitor
is recommended for Wave Soldering.
Does anyone know the difference in construction between the Capacitors for
Reflow and Wave Soldering?
Is it possible that this be cause for the tombstoning?
I am also sending pictures for cross section for the capacitors that we are
using (Recommended for Wave Soldering).
They could be seen at Steve's site.


Regards

Alejandro Becerra


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