-----Original Message-----
From: Denny McGuirk 
Subject: FW: SOLDERTEC Announces Winners of Lead-free Solder Awards 2002

In case you have not seen.  Denny

-----Original Message-----
From: Custer Consulting [mailto:[log in to unmask]]
Sent: Wednesday, December 18, 2002 12:36 PM
To: [log in to unmask]
Subject: SOLDERTEC Announces Winners of Lead-free Solder Awards 2002

PennWell Corporation

(December 18, 2002) UK -- SOLDERTEC announces that three lead-free
solder award winners have been selected in 2002 from the nominations
received from industry. 

This year's award selections have been designed to reflect the recent
rapid and significant advances in lead-free knowledge and activity in
North America while at the same time rewarding individuals with a
long-term involvement in lead-free. Each winner has been active in
lead-free in that region for a number of years, and each have
participated in the development of lead-free from the early stages of
the technology.

The winners are:

Dongkai Shangguan, Ph.D., director of advanced process technology,
Flextronics US and previously of Ford/Visteon 

David Bergman, VP standards, technology and international relations, IPC
- Association Connecting Electronics Industries

The Lead-free Component Focus Group, Chaired by Mark Kwoka of Intersil,
and with core group members Lee Whiteman (ACI), Jeff Cannis (Amkor),
Gerald O'Brien (Photocircuits), Dave Hillman (Rockwell Collins), Michael
Toben (Shipley Ronal) and Rob Schetty (Technic)

These winners reflect a range of activities on lead-free soldering from
industrial road mapping and leadership, to detailed technical studies. 

Shangguan has been selected to receive a Lead-free Solder Award in
appreciation of his long-term involvement in lead-free research and
implementation. This is also in recognition of his industry leadership
through his work both at Flextronics and previously as senior
technicalsSpecialist at Ford/Visteon Electronics Division. For example,
Shangguan formed and leads the "EMS Forum on Lead-free PCB Assembly," is
involved with various standards bodies, has published various papers and
other publications, and directed Ph.D. studentships. He has also
directed the work at Flextronics to qualify 17 global factories for
lead-free production. 

Bergman has been granted the award in recognition for his leadership of
U.S. industry towards lead-free implementation. His contributions
include lead-free roadmapping, organization of landmark conferences and
events, dissemination and training activities, and participating on
international lead-free co-ordination activities. 

The Lead-free Component Focus Group has also been granted an award in
recognition of their pioneering work on lead-free components in the US.
The group has carried out research on solderability, moisture
sensitivity, soldering processes, assembly reliability and tin whisker
growth. Members of the group are also involved in development of
standards for lead-free components. 

The SOLDERTEC award was established in 1999 to mark the launch of the
Tin Technology Lead-free Soldering Centre (SOLDERTEC) and was granted in
its first year to Kenichiro Suetsugu, Ph.D. of Panasonic, Japan in
recognition of the successful introduction of lead-free soldering in
mass production of the portable MiniDisc SJ-MJ30-S. 
 
Tin Technology is a membership-based organization involved in the
research, development and marketing of tin-based technologies. For more
information, visit www.lead-free.org.

SOLDERTEC is a membership-based organization. Members receive a unique
package of benefits that aims to provide access to leading-edge
lead-free research and information within a community of key electronics
industry technologists. 

 

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