Thank-you all for the suggestions.  The first one we are going to try, if
for no other reason than it appears so simple and you kick yourself for not
thinking to try it is Eddies suggestion of routing before etching.  The
theory being that you create the bur but you now have the back of the burr,
copper, exposed which will be removed by the etchant.  The tin plating,
should it hang on will be removed during tin strip.  It remains to be seen
how clean the final demarcation edge will be.  The high pressure water and
laser options sound very nice but we certainly do not have the margins to
subcontract nor the capitol to invest in the equipment.

I will post the results to the list.

Merry Christmas
John Parsons

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Mark Hargreaves
> Sent: December 20, 2002 5:51 AM
> To: [log in to unmask]
> Subject: Re: [TN] FAB: Edge Plating and Burrs after Routing
>
>
> Hi All,
> We faced the same fab challenge (I think) earlier this year.  We called it
> the half hole board from _ _ _ _!
> Internal rectangular cutout (non edge plated) which bisects 28 plated
> through holes (dip pattern).
> Tried various router bits & paths. Tried small pilot holes to cut
> the plated
> holes prior to route.  Tried routing the cutout after Blackhole but before
> copper plating.  This worked best.........except for a thin surface shorts
> like those that John P. encountered. (sound familiar)?
> Kicking myself for not consulting this esteemed forum at the time.  Good
> money job if we could have made it.
> Water...........who'da thunk it !
>
> ---John.  please provide feedback if you decide to go this (route).
>
> Regards & Happy Holidays,
> Mark H.

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