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December 2002

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Subject:
From:
Jeff Ferry <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 19 Dec 2002 10:15:04 -0500
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Pankaj,

I suppose you're looking for data on original build, but for BGA rework we
generally use stencils with the following dimensions.

Pitch                   Stencil Thickness               Aperture Diameter
.039"(1.00 mm)  .004"(0.102 mm)                 .020"(0.508 mm)
.050"(1.27 mm)  .006"(0.152 mm)         .025"(0.635 mm)

We have exception to these sizes, but use them as a starting point. I have
some additional info at:
http://www.circuittechctr.com/products/201-3120.htm.

Jeff Ferry
CEO
Circuit Technology Center, Inc.
http://www.circuittechctr.com
[log in to unmask]
978-374-5000 x14

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-----Original Message-----
From: Karnwal, Pankaj [mailto:[log in to unmask]]
Sent: Wednesday, December 18, 2002 11:17 PM
To: [log in to unmask]
Subject: [TN] BGA paste deposit


Hello Technet
I want know that how much solderpaste deposit required for reliable  BGA
soldering with respect to the pitch and the pad size. Is that the 120% of
the pad in case of less than 1mm pitch ( Micro BGA )

With regards
Pankaj Karnwal
QualityAssurance
BESL A-4,Sec-5 NOIDA,201301,INDIA
e mail : <mailto:[log in to unmask]>
Barco,innovators in image processing

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