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December 2002

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Subject:
From:
Jowan Iven <[log in to unmask]>
Reply To:
Date:
Tue, 3 Dec 2002 07:55:14 +0100
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Hi Chris,

I have seen a similar problem on our GEM machines.
The solderpaste was blown away from the pad.

The problem was solved when we adjusted the blow-off time.


Jowan Iven


-----Original Message-----
From:   TechNet [mailto:[log in to unmask]] On Behalf Of Chris Murphy
Sent:   maandag 2 december 2002 21:22
To:     [log in to unmask]
Subject:        [TN] Solder paste disintegration

Hi everyone,

during trials with a new solder paste recently we noticed solder balls
appearing
around the placement machine interior - on the nozzles, conveyor rail, etc.
Our
current theory is that the paste is being blown off the pads after component
placement when the nozzle stops the vacuum and blows a small burst of
positive
pressure air to ensure the component separates from the nozzle.

The paste supplier says that he has never heard of this before, yet it
happened
across all of our placement machines (we use Phillips Gem series / Yamaha YV
machines).

Has anyone else seen this before?  Maybe the flux is not viscous enough, and
the
balls are too small?  We keep our machines in good condition, so I am pretty
sure it
is not related to the machines.

Thanks for any replies.

Regards,

Chris Murphy,
Production Engineering,
Tait Electronics

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