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December 2002

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Subject:
From:
Sonny Jee <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 3 Dec 2002 13:57:22 +0900
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 $)C
Hi Dennis,

You must have received some feedback from technetters already. Process
control of Copper plating in PCB manufacturing also could be one of the
major factor. From a metallurgical standpoint, the failure can be caused by
over-add of the brightener. Interstitial atoms in a ductile metal structure
such as copper will harden the metal (embrittlement in extreme cases).

FYI, the brighteners are typically small-molecular-weight disulfide
compounds, with the general structure R-S-S-R. The R groups are organic
functional groups and vary from one brightener system to the other.

Should you need more information, you may contact me off-line.

Thanks.
Sonny




                    Dennis Bang     <v=E@N :        [log in to unmask]
                    <Dennis.Bang@G  B|A6@N :
                    PC.COM.AU>      A&8q :           [TN] via cracking
                     9_=E@N :
                    TechNet
                    <[log in to unmask]
                    rg>


                    2002-12-03
                    11:54 AM
                    "TechNet
                    E-Mail Forum."
                     ?!0T   H8=EGO?)
                     AV=J=C?@ .;
                    Dennis Bang ?!
                     0T   H8=EGO?)   AV
                     =J=C?@ .





Hi technetters,

Just wondering whether anyone has any information on via cracking/ damage
and the cause of it. We've recently had an incident with some built boards
with cracked vias and I would like to understand what could have caused it.

As always any information is greatly appreciated.

Best Regards
Dennis Bang

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