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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 10 Dec 2002 15:34:05 -0700 |
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Ted,
A JEDEC committee controls the spec for memory modules and it calls out 0.76
micrometers minimum of Electrolytic Gold over 2.0 micrometers of
electrolytic nickel minimum as "preferred". It does "allow" thin gold (such
as ENIG) to be used provided an electrical contact grade corrosion barrier
lubricant is used.
Of course, the customer does have the right to call out their "own" spec.
But then, that's all a part of the business deal.
Ryan Grant
-----Original Message-----
From: Ted Kong [mailto:[log in to unmask]]
Sent: Tuesday, December 10, 2002 11:50 AM
To: [log in to unmask]
Subject: [TN] Gold finger plating requirement for memory module
Hi all,
Is the gold finger plating requirement on memory
module different from the standard edge connector of
100-200 mirco inches of Ni over 20-30 micro inches of
Au?
Regards,
Ted
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