Hey Mike,
How familiar are you with the military supply system?
On the weapon system sustainment side, our parts primarily come from the
Defense Logistics Agency (DLA). You might try a search on
http://www.dla.mil for lean and see what it turns up. They probably have an
office set up for it.
For new acquisitions, you'd have to talk with either the contractor's or the
weapon system's program office.
A little closer to home, Robins AFB recently started a significant lean
effort. I'll put you in contact with one of our Change Agents off list.
It's a fairly new project and they would know of any possible
opportunities/examples.
And from my own experience a manufacturing operation that minimizes waste is
a lower risk to schedule, cost and quality.
Hans
~~~~~~~~~~~~~~~~~~~~~~~~~~~
Hans M. Hinners
Warner Robins Air Logistics Center (WR-ALC)
226 Cochran Street
Robins AFB, GA 31098-1622
Tele: (478) 926 - 5847 [DSN Prefix: 468]
Fax: (478) 926 - 4911
mailto:[log in to unmask]
-----Original Message-----
From: WEEKES, MICHAEL HS-SNS [mailto:[log in to unmask]]
Sent: Tuesday, December 10, 2002 12:22 PM
To: [log in to unmask]
Subject: [TN] request for info - government contacts - cost reduction
initiativ es
Are there any defense contractors out there who have any customer (DoD,
Army, Navy, etc.) contacts (names, phone numbers, email addresses or
websites) working to find cost reduction opportunities with their
electronics suppliers / contractors. I am looking to find government
organizations who win when they utilize suppliers who practice lean
manufacturing, best practices and the like. For me, I am seeking customers
who can help reduce the barriers (ex. Mil specs for non-value added
requirements).
thanks,
Mike Weekes
[log in to unmask]
-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Tuesday, December 10, 2002 9:02 AM
To: [log in to unmask]
Subject: Re: [TN] BGA standoff distance
Hi Joe,
You ask: "Is standoff distance considered a good indicator of correct solder
ball
collapse? Is there a formula for calculating what the theoretical standoff
distance should be after reflow based on package weight, solder ball
diameter, # of balls, etc...?"
Standoff height is the major geometric parameter besides component size
determining solder joint reliability. Observed height variations are
indicative of BGA warpage during reflow soldering. BGA warpage during reflow
is a fuction of unequal heating and thermally asymmetric design. If the
corner solder joints are the ones with the shorter standoff height
reliability is reduced.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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