I would pose this to the LF forum but most of the people contribute to both
and some might benefit from the discussion here.
This is a question posed to me and to tell the truth I had not considered
it. Just never came up until now.
"With the use of Lead Free (high Sn) solder alloys to pretin and prepare
fine (small) conductors, we have experienced unacceptably reduced conductor
diameters which was not the case with standard Sn63 alloys and the same pot
temperature." My hunch is that the increased Sn content is the culprit, and
as such, is there a lead free alloy that would support a consistently
solderable surface preparation while not introducing lead or contributing to
reduction of the conductor? Any experience or recommendations?

Mel Parrish
Director, Training Materials Resources
Soldering Technology International
102 Tribble Drive
Madison, AL 35758
256 705 5530
256 705 5538 Fax
[log in to unmask]
www.solderingtech.com

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------