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| From: | |
| Reply To: | (Leadfree Electronics Assembly Forum) |
| Date: | Mon, 9 Dec 2002 16:57:32 -0700 |
| Content-Type: | text/plain |
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Vladimir,
Try looking under "Black Pad".
David A. Douthit
Manager
LoCan LLC
Vladimir Igoshev wrote:
> Dear All,
>
> I'm looking for any references related to so called "Brittle Fracture"
> phenomenon, which sometime can be obeserved in solder joints between BGA
> componets and ENIG finished boards.
>
> Vladimir Igoshev, Ph.D.
> Research in Motion
> Canada
>
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