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Subject:	Re: "Brittle Fracture"
From:	Dave Hillman <[log in to unmask]>
Reply To:	(Leadfree Electronics Assembly Forum)
Date:	Mon, 9 Dec 2002 16:27:11 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (59 lines)

Hi Vladimir! This is going to sound silly but I recommend you check with
Bev Christian at RIM (his office should be close to yours!) - Bev should
have the last couple of IPC Conference Proceedings which contain a number
of good papers on the "black pad phenomena".

Dave Hillman
Rockwell Collins
[log in to unmask]




Vladimir Igoshev <[log in to unmask]>@ipc.org> on 12/09/2002 03:27:19 PM

Please respond to "(Leadfree Electronics Assembly Forum)"
       <[log in to unmask]>; Please respond to Vladimir Igoshev
       <[log in to unmask]>

Sent by:    Leadfree <[log in to unmask]>


To:    [log in to unmask]
cc:

Subject:    [LF] "Brittle Fracture"


Dear All,

I'm looking for any references related to so called "Brittle Fracture"
phenomenon, which sometime can be obeserved in solder joints between BGA
componets and ENIG finished boards.

Vladimir Igoshev, Ph.D.
Research in Motion
Canada

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