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December 2002

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From:
"Karnwal, Pankaj" <[log in to unmask]>
Date:
Thu, 19 Dec 2002 05:17:29 +0100
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"TechNet E-Mail Forum." <[log in to unmask]>, "Karnwal, Pankaj" <[log in to unmask]>
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Hello Technet
I want know that how much solderpaste deposit required for reliable  BGA
soldering with respect to the pitch and the pad size. Is that the 120% of
the pad in case of less than 1mm pitch ( Micro BGA )

With regards
Pankaj Karnwal
QualityAssurance
BESL A-4,Sec-5 NOIDA,201301,INDIA
e mail : <mailto:[log in to unmask]>
Barco,innovators in image processing

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