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December 2002

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From:
Michelle Huang <[log in to unmask]>
Date:
Mon, 2 Dec 2002 18:58:25 -0800
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1.0
X-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Dennis Bang <[log in to unmask]>
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"TechNet E-Mail Forum." <[log in to unmask]>, Michelle Huang <[log in to unmask]>
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cracking can be contributed to tensile and compressive force within or
exterior to the via.  Depending on the location of the crack, it's hard to
determine how the via was cracked and by what material. -michelle

-----Original Message-----
From: Dennis Bang [mailto:[log in to unmask]]
Sent: Monday, December 02, 2002 6:55 PM
To: [log in to unmask]
Subject: [TN] via cracking


Hi technetters,

Just wondering whether anyone has any information on via cracking/ damage
and the cause of it. We've recently had an incident with some built boards
with cracked vias and I would like to understand what could have caused it.

As always any information is greatly appreciated.

Best Regards
Dennis Bang

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