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November 2002

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 8 Nov 2002 15:33:08 EST
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Hi robert,
You need to drill the hole into the PCB pad and place the thermocouple inside
the solder joint/ball/column. You need to measure the T of the solder joints,
not the air space underneath the BGA nor the PWB. At the very least, the T of
the BGA should be measured.

Werner Engelmaier
Co-Chair, IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering
Processes (Reflow & Wave)" Task Group

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