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November 2002

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 6 Nov 2002 09:43:18 -0800
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text/plain (53 lines)
        Heat bondable preforms work well. Once the material bonds and
hardens it does not go any where. There are more than one manufacturer of
these types.
        Regards,
        Ramon

> -----Original Message-----
> From: Genny Gibbard [SMTP:[log in to unmask]]
> Sent: Wednesday, November 06, 2002 10:53 AM
> To:   [log in to unmask]
> Subject:      [TN] heatsinking a PCB
>
> We have a small PCB with SM components mounted on one side and a heatsink
> mounted against the other side over the entire surface of the PCB.  The
> heatsink is grounded, so we use a thermally conductive, electrically
> isolative thermal interface material in between (0.5mm thick), to protect
> signal vias.  We also use some strips of electrically conductive gasket in
> strategic areas to provide good electrical grounding between the two.
> Migration of some substances out of the thermal material onto the PCB over
> time has caused performance problems on random, not all, units.
>
> I was wondering what other methods might exist for heatsinking a PCB,
> possibly permanently bonding the metal heatsink to the PCB in some way.
> Any sources of information for alternatives is appreciated.  We cannot
> change the construction materials of the original PCB, which is a
> multilayer (4 layer) FR4, but we may be able to bond an additional layer
> onto the PCB, in place of the gasketing we use now.
>
> Thanks in advance,
> Genny
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