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Subject:	Re: Plating Au over Cu
From:	Guy Ramsey <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Fri, 1 Nov 2002 10:31:29 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (48 lines)

I wouldn't worry about it. It does not sound like you are relying on the
solder fill to do anything. So, cracking of at the interface of the
solder to the gold would not matter. Am I missing something here?

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
> Sent: Friday, November 01, 2002 8:23 AM
> To: [log in to unmask]
> Subject: [TN] Plating Au over Cu
>
>
> Fellow TechNetters,
>
>    Can you please share your concern with plating hard gold,
> 25 micro inches, on fingers of a PCB over
> an area adjacent to PTH's where some unplugged via exhibit
> SnPb.   I guess
> my main concern is Au/SnPb.
>
> Victor G. Hernandez
>
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