try IPC-2141. fig 10 on page 17
Ray Klein
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, November 04, 2002 11:07 PM
To: [log in to unmask]
Subject: [TN] COUPON INTEGRATION METHODOLOGY FOR 'CONTROL IMPEDENCE'
Multilayer PCBs
Dear all,
We are a PCB fabricator and manufacture MULTILAYER PCBs which are designed
for 'CONTROL IMPEDENCE'.
We have full info of the controls to be followed wrt LINEWIDTH and
DIELECTRIC THICKNESS during the fabrica-
tion of the CI pcbs as per the data provided by the customer/designer of
the circuit based on their end application.
We also have literature info about the range of DIELECTRIC CONSTANT VALUES
for different raw materials
and their variations wrt frequency, thickness, resin content and other
related parameters. The formulae to be
used for theoritical calculations for STRIPLINE/MICRO STRIPLINE
CONFIGURATIONS are also known.
We have gone through the IPC 2221 AND IPC 2222 standards guidelines, but do
not find CORRECT INFO on
the type and methodolgy of COUPONS with suitable test points to represent
the CIRCUIT REQTS, (for different
designs) for CONTROL IMPEDENCE PCBs which can be used for measurement
purposes to confirm that the
desired values have been achieved in the fabricated PCB .
Request useful guidelines on the Approach and Methodology to be followed
for COUPONS INTEGRATION
in Fabrication for confirming the designed Control Impedence Values are
obtainable through measurements
on the coupons using Standard TDR or any other dedicated measurement
set-up.
Regards,
M A Ranganath
GM - Technical & Quality
Sanmar Micropack Limited
Plot No.16, Jigani Industrial Area,
Bangalore - 562 106. INDIA
Phone: 91 - 80 - 7825223/224/226/389
Fax : 91 - 80 - 7825225
Email : [log in to unmask]
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