Hi,

We are using hot air not only to remove, but solder the
component back onto the pad as well.

However, it is very much depending upon operator's skill.
Not all operators can do that well.

Poh

--- Kathy Kuhlow <[log in to unmask]> wrote:

> The hot air technique might work well for the 20mil pitch device if
> it has enough mass.  I have found with 0603 and 0402 hot air reflow
> is only good at blowing the part off the PCB.  I would suggest a
> tweezer soldering iron for those parts.
>
> Kathy
>
>
> >>> [log in to unmask] 11/27/02 03:48PM >>>
> Can anyone recommend good soldering technique for
> hand assembly of 20mil pitch devices and 0603, 0402
> SMT chips? We are looking at doing some protoype
> assembly on some fairly dense (and small) pcbs. We
> were thinking of using solderpaste and one of those
> portable solder pens with a hot air tip ie. Weller
> Portasol.  Has anyone had success using this
> technique?
> Thanks
> Ron.
>
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