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November 2002

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Subject:
From:
"d. terstegge" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 28 Nov 2002 13:14:29 +0100
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Hi Ron,

For the chips I would recommend to keep the part in place with a
tweezer while making the solderjoint with a fine soldertip and a thin
solderwire.
To my opinion the best manual soldering method for fine-pitch QFP's is
described on http://www.metcal.tips/minhoof2.html. In this method you
must place a quantity of solder onto the face of a specially formed tip,
after which your draw the tip along the row of fluxed leads, virtually
"painting" the leads with solder.

Best regards,

Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net


>>> [log in to unmask] 11/27/02 10:48pm >>>
Can anyone recommend good soldering technique for
hand assembly of 20mil pitch devices and 0603, 0402
SMT chips? We are looking at doing some protoype
assembly on some fairly dense (and small) pcbs. We
were thinking of using solderpaste and one of those
portable solder pens with a hot air tip ie. Weller
Portasol.  Has anyone had success using this
technique?
Thanks
Ron.

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