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November 2002

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Subject:
From:
"Jason W. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 27 Nov 2002 15:49:10 -0600
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Good point, Kathy!

I completely centered my response around his 20 mil question and forgot to
address the passive devices portion of his question. Yes, tweezer tips are the
best for the small ones.

Jason Gregory





Kathy Kuhlow <[log in to unmask]> on 11/27/2002 03:41:10 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
      Kathy Kuhlow <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Jason Gregory/LABARGE)

Subject:  Re: [TN] Hand soldering fine pitch SMT



The hot air technique might work well for the 20mil pitch device if it has
enough mass.  I have found with 0603 and 0402 hot air reflow is only good at
blowing the part off the PCB.  I would suggest a tweezer soldering iron for
those parts.

Kathy


>>> [log in to unmask] 11/27/02 03:48PM >>>
Can anyone recommend good soldering technique for
hand assembly of 20mil pitch devices and 0603, 0402
SMT chips? We are looking at doing some protoype
assembly on some fairly dense (and small) pcbs. We
were thinking of using solderpaste and one of those
portable solder pens with a hot air tip ie. Weller
Portasol.  Has anyone had success using this
technique?
Thanks
Ron.

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