Cay you help me with observations on solder fillet characteristics of
SMT components with Ag/Pt end metallization?
What is the intermetallic SnAg or SnPt?
What are the wetting characteristics? Is it as bad as Palladium?
Does the metallization alter the surface appearance of the solder
fillets? Are they normally dull or grainy, or bright and shiny?

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