Hi Yannick! Not all immersion tin chemistries are created equal - some are
much more robust in terms of thermal excursion degradation than others. I
recommend you conduct a solderability test per JSTD-003 to determine if
your solderability has gone south or if you are having a solder process
issue. Good Luck.

Dave




Yannick Brisson <[log in to unmask]>@ipc.org> on 11/25/2002 07:03:35 AM

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Subject:    [TN] Immersion Tin


Hi,

  I made a board wich I plated with immersion Tin, I tought it should be
the
same result as we had with tin lead but we ran into a weird problem.  We
use
a 63/37  no clean paste and on the Board with Immersion Tin the solder just
make a ball ON the pad...we ran the same profile with a board Tin-Lead and
we get almost a perfect solder joint.  Because it's immersion tin should we
put our temperature higher?

  We try to solder with a iron and the paste can hardly wet all the pad the
fisrt time..if we do it a first time, cleand the pad and do it again it's
more easy.  If someone have work with it can give me some trick I would
appreciate.

Thanks You

Yannick Brisson
============================
Technicien Ingénierie de Production
Technician Production ingineering
M2S Électronique
2855, Rue de Celles
Québec, Québec
G2C 1K7
Téléphone: (418) 842-1312 Ext: 264
Télécopie: (418) 842-0123
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