Have you worked with immersion tin in the past? Some literature will tell
you run it the same as sn/pb, others will say use a different profile. The
pcb shop, or immersion tin vendor would be a good source of information on
the appropriate profile to use.

Lumping into a ball, and not wetting really sounds like a contaminate issue,
oxidation, poor tin coating, possibly a flux/paste issue...

Contact the pcb shop that provided you the board, they should be able to
assist...

Franklin


----- Original Message -----
From: "Yannick Brisson" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, November 25, 2002 7:03 AM
Subject: [TN] Immersion Tin


Hi,

  I made a board wich I plated with immersion Tin, I tought it should be the
same result as we had with tin lead but we ran into a weird problem.  We use
a 63/37  no clean paste and on the Board with Immersion Tin the solder just
make a ball ON the pad...we ran the same profile with a board Tin-Lead and
we get almost a perfect solder joint.  Because it's immersion tin should we
put our temperature higher?

  We try to solder with a iron and the paste can hardly wet all the pad the
fisrt time..if we do it a first time, cleand the pad and do it again it's
more easy.  If someone have work with it can give me some trick I would
appreciate.

Thanks You

Yannick Brisson
============================
Technicien Ingénierie de Production
Technician Production ingineering
M2S Électronique
2855, Rue de Celles
Québec, Québec
G2C 1K7
Téléphone: (418) 842-1312 Ext: 264
Télécopie: (418) 842-0123
[log in to unmask]
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