Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 25 Nov 2002 08:03:35 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi,
I made a board wich I plated with immersion Tin, I tought it should be the
same result as we had with tin lead but we ran into a weird problem. We use
a 63/37 no clean paste and on the Board with Immersion Tin the solder just
make a ball ON the pad...we ran the same profile with a board Tin-Lead and
we get almost a perfect solder joint. Because it's immersion tin should we
put our temperature higher?
We try to solder with a iron and the paste can hardly wet all the pad the
fisrt time..if we do it a first time, cleand the pad and do it again it's
more easy. If someone have work with it can give me some trick I would
appreciate.
Thanks You
Yannick Brisson
============================
Technicien Ingénierie de Production
Technician Production ingineering
M2S Électronique
2855, Rue de Celles
Québec, Québec
G2C 1K7
Téléphone: (418) 842-1312 Ext: 264
Télécopie: (418) 842-0123
[log in to unmask]
============================
---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
|
|