Ioan,
I think you can find instances of both, but it is the ones that make it
through ICT that are really painful. Since the fracture site is flat and at
the pad level, it is very easy for the "black pads" to make electrical
contact during ICT. This is especially true if you have a mechanical pull
down type fixture.
Thanks,
Robert Furrow
Printed Wiring Board Engineer
Supply Chain Networks
Lucent Technologies
978-960-3224 [log in to unmask]
-----Original Message-----
From: Tempea, Ioan [mailto:[log in to unmask]]
Sent: Friday, November 22, 2002 12:39 PM
To: [log in to unmask]
Subject: Re: [TN] Black pads suspected on ENIG pcbs: how to screen
assembl ed pcbas ?
Hi Mario and gentlemen,
my question is if black pad is a time bomb, providing unreliable connections
that will pass the functional test only to fail in the field. Or rather, the
problem will appear right away after reflow and every single assembly that
has black pad would fail test.
Thanks,
Ioan
> -----Original Message-----
> From: Mario Dion [SMTP:[log in to unmask]]
> Sent: Friday, November 22, 2002 10:46 AM
> To: [log in to unmask]
> Subject: [TN] Black pads suspected on ENIG pcbs: how to screen
> assembled pcbas ?
>
> Bonjour to the TECHNET people,
>
> What kind of screen testing must be perform on assembled units where black
> pads problem is suspected ?
>
> The goal is to assess the reliability of the units.
>
> Thanks in advance for your help,
>
> Enjoy the week end !
>
> Mario
>
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