Those ramps may be too high for some packages. 4 degrees  and 6 degrees
are old target values in Fahrenheit.  2 degrees is the value when using
Celsius. We have seen some parts that require ramp rates of only 1
degree C. But otherwise, no, while the recipe may vary the profile does
not.

Guy Ramsey
American Competitiveness Institute
Senior Lab Technician/Instructor
E-Mail: [log in to unmask]
Ph: (610) 362-1200 x107
Fax: (610) 362-1290



> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Tobias.Chang
> Sent: Thursday, November 21, 2002 2:29 PM
> To: [log in to unmask]
> Subject: [TN] Rework vs Oven Reflow Profile
>
>
> Hello everyone,
>
> Is there any variation from the 'ideal' profile one aims for
> when developing a profile for a board in the oven, compared
> to a profile one should gun for when developing a profile for
> an individual chip when reworking a board?
>
> The 'ideal's' I'm working with are,
> max temp between 210-200 degC
> 45-75s above 183 deg C
> ramp up no more than 4 deg/s
> ramp down no more than 6 deg/s
>
> Thanks for all your help,
>
> Toby
>
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