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November 2002

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 19 Nov 2002 09:11:02 +0200
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I've replied elsewhere regarding the ozone-depletion potential of HCFC-141b.

HCFC-141b is in the process of being phased out as a solvent, but this
is a national, rather than an international process. HOWEVER, although
its blends have a higher Kauri-butanol number than CFC-113, it has often
proved to be a poor solvent for many rosin-based flux residues,
especially RMA types. "White residues" are a frequent result and
reliability has been shown to be diminished with some flux/solvent
combinations. It also tends to be aggressive (stress cracking) towards
some polymers, so be careful if you use polystyrene or polycarbonate
capacitors (or other insulation) or even PVC. Be sure to do your
qualification testing very well!

Brian

Juan T. Marugán wrote:
> Hi technetters !
>
> Although I’ve read some messages about this matter, let me ask you some
> additional information.
>
> For our class 3 boards (avionics & military), we used rosin fluxes (ROL0).
> Now, we are thinking about to subcontract the assembly of some type of
> boards. One of the possible subcontractors uses no-clean organic flux
> (ORL0) for wave soldering. No post-solder cleaning is performed.
>
> After this assembly, we have to solder some components/wires to these
> boards so we will use our rosin flux. And, at the end, boards will
> conformal coated with Humiseal (acrylic).
>
> My questions are:
>
> 1.- Can the use of an organic flux (residues) to produce some effect in the
> solder joints performed later using rosin flux?
> 2.- What happen when these boards are cleaned with CFC solvents (Forane)?
> 3.- Have no-clean flux residues some effect in the quality (adherence, ...)
> of conformal coating?
>
> Thank you from Spain for your help.
>
>
> Juan T. Marugán López
> Production Quality Assurance
>
> INDRA EWS, Sociedad Anónima
> C/ Joaquín Rodrigo 11
> 28300 Aranjuez - Madrid (SPAIN)
> [log in to unmask]
> www.indra.es
>
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