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November 2002

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Subject:
From:
David Douthit <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 18 Nov 2002 12:47:05 -0700
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Juan,

I want to echo what Brian as said and add one thing.

In the United States the FAA and the DoD do not look favorably on the
"no-clean" process in general and conformal coating over "no-clean" fluxes
in particular for flight and mission critical systems.

David A. Douthit
Manager
LoCan LLC

"Juan T. Marugán" wrote:

> Hi technetters !
>
> Although I’ve read some messages about this matter, let me ask you some
> additional information.
>
> For our class 3 boards (avionics & military), we used rosin fluxes (ROL0).
> Now, we are thinking about to subcontract the assembly of some type of
> boards. One of the possible subcontractors uses no-clean organic flux
> (ORL0) for wave soldering. No post-solder cleaning is performed.
>
> After this assembly, we have to solder some components/wires to these
> boards so we will use our rosin flux. And, at the end, boards will
> conformal coated with Humiseal (acrylic).
>
> My questions are:
>
> 1.- Can the use of an organic flux (residues) to produce some effect in the
> solder joints performed later using rosin flux?
> 2.- What happen when these boards are cleaned with CFC solvents (Forane)?
> 3.- Have no-clean flux residues some effect in the quality (adherence, ...)
> of conformal coating?
>
> Thank you from Spain for your help.
>
> Juan T. Marugán López
> Production Quality Assurance
>
> INDRA EWS, Sociedad Anónima
> C/ Joaquín Rodrigo 11
> 28300 Aranjuez - Madrid (SPAIN)
> [log in to unmask]
> www.indra.es
>
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