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November 2002

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Subject:
From:
Eric Dawson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 18 Nov 2002 17:15:13 -0000
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Werner,
I could use some myself for internal quality training.
I have recently soaked some BGAs and some quad packs in water for over a
week before putting them through a reflow profile. I have yet to produce
visible evidence of pop corning.
The annoying thing is, a while ago we used some BGAs on a tape where the
moisture indicator went just a little pink and they pop corned. The visual
evidence was fat solder deposits and shorts in the middle of the package
where it bowed downwards. My street cred. with the managers around here has
taken a beating since I have failed to reproduce the problem.
Oh well, I'd rather be happy than right.
Regards
Eric Dawson

> -----Original Message-----
> From: Werner Engelmaier [SMTP:[log in to unmask]]
> Sent: Monday, November 18, 2002 4:02 PM
> To:   [log in to unmask]
> Subject:      [TN] Popcorning
>
> Hi 'Netters,
> Could any of share some good pictures of a 'popcorned' component and a
> component with delaminated die. I would of course give full credit as to
> source.
>
> Thanks,
> Werner Engelmaier
>
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