Hi technetters !

Although I’ve read some messages about this matter, let me ask you some
additional information.

For our class 3 boards (avionics & military), we used rosin fluxes (ROL0).
Now, we are thinking about to subcontract the assembly of some type of
boards. One of the possible subcontractors uses no-clean organic flux
(ORL0) for wave soldering. No post-solder cleaning is performed.

After this assembly, we have to solder some components/wires to these
boards so we will use our rosin flux. And, at the end, boards will
conformal coated with Humiseal (acrylic).

My questions are:

1.- Can the use of an organic flux (residues) to produce some effect in the
solder joints performed later using rosin flux?
2.- What happen when these boards are cleaned with CFC solvents (Forane)?
3.- Have no-clean flux residues some effect in the quality (adherence, ...)
of conformal coating?

Thank you from Spain for your help.


Juan T. Marugán López
Production Quality Assurance

INDRA EWS, Sociedad Anónima
C/ Joaquín Rodrigo 11
28300 Aranjuez - Madrid (SPAIN)
[log in to unmask]
www.indra.es

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