Peter,
thank you for the input. You are right the ink need to be electrically
non-conductive ink. We need to fill up holes of 2,0 mm in a core of 1,5 mm.
At this core-thickness - to my knowledge - it is not possible to fill by
using high-resin content prepreg.

We have tried with Peters plugging paste 2795 which we use for ordinary
plugging with good results. However for this application the viscosity of
the paste is rather low, so we have a lot of hassle to make it work.


With best regards

Jan Thuesen

 -----Oprindelig meddelelse-----
Fra:    [log in to unmask] [mailto:[log in to unmask]]
Sendt:  18. november 2002 02:00
Til:    TechNet E-Mail Forum.; Jan Thuesen
Cc:     [log in to unmask]
Emne:   Re: [TN] Via plugging


Jan,

I take it you mean electrically non-conductive rather than thermally
non-conductive? Filling holes in internal layers is often done with
high-resin content pre-preg. What is your application that this is not a
solution for you?

Peter



Jan Thuesen <[log in to unmask]>      15/11/2002 08:55 PM
Sent by: TechNet <[log in to unmask]>

Please respond to "TechNet E-Mail Forum."; Please respond to Jan Thuesen


              To:  [log in to unmask]

              cc:  (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)

              Subject: [TN] Via plugging












We need to plug vias on internal layers of 2,0 mm diameter. It has to be
with a non-conductive material. Do any of you have recommendations of a
hole
filling material with this capability. Most of the material for ordinary
innerlayer viaplugging has to low viscocity to provide a reliable fill.


Any input will be welcome.

With best regards

--
Jan Thuesen, Process Engineer
Chemitalic A/S

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