I've done this in the past as well. Our reason was two-fold. We had components
that skewed during reflow due to bad pad design. We printed paste and then
dispensed adhesive. Roughly two thirds of the way through the reflow oven, the
adhesive cured, holding the skewing part in place during liquidous transition.
Double benefit was not having to use pallet for solder wave or having to hand
solder. Also, I am a believer that running pre-convection reflowed solder joint
across wave enhances wetting. All other posts are right about selecting correct
standoff to ensure you don't have problems with disturbing wet paste. Be careful
of not introducing glue to the paste.
Jason Gregory
Production Supervisor
LaBarge Inc.
(918)459-2367
[log in to unmask]
"Dehoyos, Ramon" <[log in to unmask]> on 11/15/2002 12:11:10 PM
Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
"Dehoyos, Ramon" <[log in to unmask]>
To: [log in to unmask]
cc: (bcc: Jason Gregory/LABARGE)
Subject: Re: [TN] Glue dispensing
[Dehoyos, Ramon] Another way would be to place the SMT components
on both sides without any glue and mask the components that are going to be
in the wavesolder with PC Flex Mask by Contronic Devices before the THT
parts are wave soldered. Personally have not used it for that purpose yet
but have talked to Contronics and been told that some customers use it in
that manner. AT this time that mask is being used to cover areas that do
not need to be soldered.
Regards,
Ramon
> -----Original Message-----
> From: Paul Truit [mailto:[log in to unmask]]
> Sent: Friday, November 15, 2002 8:37 AM
> To: [log in to unmask]
> Subject: [TN] Glue dispensing
>
>
> In our manufacturing life when doing double sided SMT assy's that
> included through hole We have been using the stencil printer to apply
> the adhesive for the SMT components.
>
> I have a project that requires this method but the board just isn't
> designed for a high yield process through the wave solder machine due to
> component shadowing. Has anyone used a solder paste approach then put
> the boards through an adhesive dispenser? Thus you already have good
> solder joints on the SMT parts ... glue to hold them down ... and when
> the wave solder machine solders the TH parts the SMT parts are still
> soldered.
>
> Any thoughts of this process for increasing the yield of these boards?
> Redesign is pretty much out of the question.
>
> Are the bench top machines i.e. the Camelot 1414 a good match for this
> type of application? Or is there a different economical (Got to use
> that word now days) solution. We're running 3000 piece lot sizes with
> approximately 40+ SMT components.
>
> --
> Paul Truit, Mfg. Eng.
> RBB Systems, Inc.
> 4265C E. Lincolnway
> Wooster, OH 44691
> Ph. (330) 567-2906 ext 514
> Fax (330) 263-5324
> Email: [log in to unmask]
>
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