TECHNET Archives

November 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Steve Thomas <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 15 Nov 2002 08:52:55 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (106 lines)
That 45° foot doesn't work with SOTs in some orientations, don't forget.  That
was another problem we had with the process.

-----Original Message-----
From: [log in to unmask]
[mailto:[log in to unmask]]
Sent: Friday, November 15, 2002 8:46 AM
To: [log in to unmask]
Subject: Re: [TN] Glue dispensing


Paul,

We've done that on the past, the only problem here is the needle stand off
stepping on the solder paste, you can use a 45 degree angle stand off to
eliminate this problem. The other problem was epoxy contamination on the
solder due to tailing or stringing problems with the epoxy. Both the epoxy
and solder paste are submitted to a normal reflow cycle, that takes care of
both materials. The typical process flow is the following:

1. Screen Print Solder Paste Application
2. Epoxy Dot Dispense
3. Place Components
4. Solder Paste Reflow Profile
5. Flip and complete Top Side process
7. TH Insertion
8. Wave process

Good Luck!

Jorge Rodriguez
Process Engineer
Varian, Inc

-----Original Message-----
From: Paul Truit [mailto:[log in to unmask]]
Sent: Friday, November 15, 2002 8:37 AM
To: [log in to unmask]
Subject: [TN] Glue dispensing


In our manufacturing life when doing double sided SMT assy's that
included through hole We have been using the stencil printer to apply
the adhesive for the SMT components.

I have a project that requires this method but the board just isn't
designed for a high yield process through the wave solder machine due to
component shadowing.  Has anyone used a solder paste approach then put
the boards through an adhesive dispenser?  Thus you already have good
solder joints on the SMT parts ... glue to hold them down ... and when
the wave solder machine solders the TH parts the SMT parts are still
soldered.

Any thoughts of this process for increasing the yield of these boards?
Redesign is pretty much out of the question.

Are the bench top machines i.e. the Camelot 1414 a good match for this
type of application?  Or is there a different economical (Got to use
that word now days) solution.  We're running 3000 piece lot sizes with
approximately 40+ SMT components.

--
Paul Truit, Mfg. Eng.
RBB Systems, Inc.
4265C E. Lincolnway
Wooster, OH  44691
Ph. (330) 567-2906 ext 514
Fax (330) 263-5324
Email: [log in to unmask]

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2