You can guess what the normal problem would be, glue in paste. You can do
it, just be careful where the needle foot will hit. You may need to get a
new needle with the foot in another position.

You also might solve the problem by using the dispenser to place some paste
in the shadows. (It takes too long to do a whole board.)

-----Original Message-----
From: Paul Truit [mailto:[log in to unmask]]
Sent: Friday, November 15, 2002 9:37 AM
To: [log in to unmask]
Subject: [TN] Glue dispensing

In our manufacturing life when doing double sided SMT assy's that
included through hole We have been using the stencil printer to apply
the adhesive for the SMT components.

I have a project that requires this method but the board just isn't
designed for a high yield process through the wave solder machine due to
component shadowing.  Has anyone used a solder paste approach then put
the boards through an adhesive dispenser?  Thus you already have good
solder joints on the SMT parts ... glue to hold them down ... and when
the wave solder machine solders the TH parts the SMT parts are still
soldered.

Any thoughts of this process for increasing the yield of these boards?
Redesign is pretty much out of the question.

Are the bench top machines i.e. the Camelot 1414 a good match for this
type of application?  Or is there a different economical (Got to use
that word now days) solution.  We're running 3000 piece lot sizes with
approximately 40+ SMT components.

--
Paul Truit, Mfg. Eng.
RBB Systems, Inc.
4265C E. Lincolnway
Wooster, OH  44691
Ph. (330) 567-2906 ext 514
Fax (330) 263-5324
Email: [log in to unmask]

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