Yup! CR = Convection Reflow Soldering. Darn! I'm developing the local habit
of using acronyms without explaning them!

I can give you some chapter and verse on hole diameters and aspect ratios
that are successful or not, if you want. I've had 24 mil diameter holes
filled that are only 7 mils deep, and as small as 18 mils with a 4:1 aspect
ratio. I think about 12 mils at this ratio is the lower limit (certainly
with my fab shops), and 25 mils is about the upper limit if you want to
maintain a reasonably flat finish. with larger diameters, the material
tends to sag and you get dips on one side and bumps on the other. We had to
experiment a bit with hole sizes outside of this range to see what was
possible and what was not.

Depending on the application, though, I have come to realise that the
process is more trouble than it's worth most of the time.

Peter



Steve Gregory <[log in to unmask]>   15/11/2002 08:59 AM
Sent by: TechNet <[log in to unmask]>

Please respond to "TechNet E-Mail Forum."; Please respond to SteveZeva

              To:  [log in to unmask]
              cc:  (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
              Subject: Re: [TN] Conductive epoxy via filling...








Hi Peter!

I just want to ask a question about your statement below:

 It was also a compromise solution to filling all the holes with solder,
 which
 may have fallen out again during CR,


What is CR? Convection reflow?

-Steve-
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