Hello there,

I was given two components that belongs to the low profile SMDs packages
: SMD Resistor (Flip Chip version) and Basket Choke. Despite the fact
that our in-house facility called for manual soldering, the engineer has
used parts that require reflow. I have no probelm converting the pad for
reflow to manual soldering process, what I am concern is the termination
alloy used on these 2 parts and my question below :

In-house solder alloy = 63Sn/37Pb
FC resistor termination alloy = 62Sn/36Pb/2Ag
Basket choke termination alloy = 96Sn/4Ag

What are the likely problems to occur over a period of time on the
solder joints for these components? Even 1 cent opinion would be
appreciated :8)

Thanks and regards
Wee Mei

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