Hi Daan,
I am with you on your experience. The tent-profile is really bad news--except
for assemblies with all the same compenents, because it maximizes temperature
differences between thermally massive components withrespect to small
components and the PWB. It also requires a different paste flux formulation,
but that is not the problem. the problem is that in order to get large
componets hot enough, the smaller ones and the PWB are cooking.

Werner Engelmaier

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