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Subject:	Re: Void in BGA
From:	Jowan Iven <[log in to unmask]>
Reply To:	[log in to unmask]
Date:	Tue, 12 Nov 2002 07:28:59 +0100
Content-Type:	text/plain
Parts/Attachments:	text/plain (60 lines)

Yannick,

Using a tent-profile helps to reduce voiding.



Best regards


Jowan Iven
Process Engineer
Dept.   Engineering & Technology

Stork Electronics BV

-----Original Message-----
From:   TechNet [mailto:[log in to unmask]] On Behalf Of Yannick Brisson
Sent:   maandag 11 november 2002 20:05
To:     [log in to unmask]
Subject:        [TN] Void in BGA

hi,

 I would like to know if someone have ever had trouble with void in BGa, how
he solve that, I new with BGA I would like to solve this problem, we don't
have a x-ray in our facilitie so that complicated much the verification
because we much pay someone else do to it, So I 'm not pretty sure at what
we shuold look for.  If you can help me you can write me back at my email.


Thanks You

Yannick Brisson
[log in to unmask]

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