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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 11 Nov 2002 18:54:53 EST |
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Hi Toby,
Your question is a good one.
What I have done--and it works--was to grind a depression in the ceramic
component body deep enough for the T/C beat to fit flush into it. Than I
epoxy the beat into this depression; the surface is still flush so not to
affect the heat transfer. I also epoxy the length of T/C wires which ends
with the T/C onto the the surface of the commponent; thus, the impact of the
wires being heated faster than the component body and thus a giving me a
higher t-reading at the T/C is minimized. This works for both IR and
Convection reflow ovens.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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