We tried several boards with immersion tin from different vendors.
Some of them had very good solderability, others not.The soldering
conditions were the same as for hot air leveling.
We tried to see where the problem was, and saw that the problem occured
mostly on boards which were plugged BEFORE the mmersion tin plating, only on
one side. The same problem was seen on immersion silver boards which were
plugged before the final finish, and on these we run a contamination test
which they failed.
IMHO , if the boards are new, it could be a contamination issue due to
contaminants in the vias not being washed away properly because of the
plugging on one side. The interesting point was that the problem was more
visible after the second reflow.
Maybe we ca shed some light on this?
Gaby
----- Original Message -----
From: "Yannick Brisson" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, November 25, 2002 3:03 PM
Subject: [TN] Immersion Tin


> Hi,
>
>   I made a board wich I plated with immersion Tin, I tought it should be
the
> same result as we had with tin lead but we ran into a weird problem.  We
use
> a 63/37  no clean paste and on the Board with Immersion Tin the solder
just
> make a ball ON the pad...we ran the same profile with a board Tin-Lead and
> we get almost a perfect solder joint.  Because it's immersion tin should
we
> put our temperature higher?
>
>   We try to solder with a iron and the paste can hardly wet all the pad
the
> fisrt time..if we do it a first time, cleand the pad and do it again it's
> more easy.  If someone have work with it can give me some trick I would
> appreciate.
>
> Thanks You
>
> Yannick Brisson
> ============================
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