Dave,
What is the cause of "degradation"?
Do you mean that this process is not the same from one supplier to the other
? And  even more- that the procuring department should buy boards from
different suppliers according to their proven performance for each finishing
process?
By the way- that's what we try to do.
Gaby
----- Original Message -----
From: "Dave Hillman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, November 25, 2002 11:53 PM
Subject: Re: [TN] Immersion Tin


> Hi Yannick! Not all immersion tin chemistries are created equal - some are
> much more robust in terms of thermal excursion degradation than others. I
> recommend you conduct a solderability test per JSTD-003 to determine if
> your solderability has gone south or if you are having a solder process
> issue. Good Luck.
>
> Dave
>
>
>
>
> Yannick Brisson <[log in to unmask]>@ipc.org> on 11/25/2002 07:03:35 AM
>
> Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
respond
>        to Yannick Brisson <[log in to unmask]>
>
> Sent by:    TechNet <[log in to unmask]>
>
>
> To:    [log in to unmask]
> cc:
>
> Subject:    [TN] Immersion Tin
>
>
> Hi,
>
>   I made a board wich I plated with immersion Tin, I tought it should be
> the
> same result as we had with tin lead but we ran into a weird problem.  We
> use
> a 63/37  no clean paste and on the Board with Immersion Tin the solder
just
> make a ball ON the pad...we ran the same profile with a board Tin-Lead and
> we get almost a perfect solder joint.  Because it's immersion tin should
we
> put our temperature higher?
>
>   We try to solder with a iron and the paste can hardly wet all the pad
the
> fisrt time..if we do it a first time, cleand the pad and do it again it's
> more easy.  If someone have work with it can give me some trick I would
> appreciate.
>
> Thanks You
>
> Yannick Brisson
> ============================
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