Hello everyone,
Is there any variation from the 'ideal' profile one aims for when developing
a profile for a board in the oven,
compared to a profile one should gun for when developing a profile for an
individual chip when reworking a board?
The 'ideal's' I'm working with are,
max temp between 210-200 degC
45-75s above 183 deg C
ramp up no more than 4 deg/s
ramp down no more than 6 deg/s
Thanks for all your help,
Toby
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