Yes Peter,

It is a steady ramp to a peak temperature followed by a normal
coolingperiod.
Using this tentprofile instead of a profile with a "horizontal"  soakzone
helps reducing voids in bga-solderjoints.


Jowan



-----Original Message-----
From:   TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent:   dinsdag 12 november 2002 7:34
To:     [log in to unmask]
Subject:        Re: [TN] Void in BGA

Quid est "tent profile"? Or is it simply a rapid ramp rate to a peak
temperature followed by natural cooling off period, as found in all
profiles but of differing ramp rate, dwell time and peak temperature?

Peter



Jowan Iven <[log in to unmask]>   12/11/2002 02:28 PM
Sent by: TechNet <[log in to unmask]>

Please respond to Jowan.Iven

              To:  [log in to unmask]
              cc:  (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
              Subject: Re: [TN] Void in BGA








Yannick,

Using a tent-profile helps to reduce voiding.



Best regards


Jowan Iven
Process Engineer
Dept.   Engineering & Technology

Stork Electronics BV

-----Original Message-----
From:   TechNet [mailto:[log in to unmask]] On Behalf Of Yannick Brisson
Sent:   maandag 11 november 2002 20:05
To:     [log in to unmask]
Subject:        [TN] Void in BGA

hi,

 I would like to know if someone have ever had trouble with void in BGa,
how
he solve that, I new with BGA I would like to solve this problem, we don't
have a x-ray in our facilitie so that complicated much the verification
because we much pay someone else do to it, So I 'm not pretty sure at what
we shuold look for.  If you can help me you can write me back at my email.


Thanks You

Yannick Brisson
[log in to unmask]

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