IPC-HDBK-001 5.1.2
Brass is an alloy consisting mainly of copper and zinc. Without a
barrier layer of copper or nickel over the brass, the zinc will dissolve
into the molten solder during soldering, Zinc contamination of the
solder joint is evident by a rough, grainy, frosty, porous surface with
a high dendritic structure. Also, solder wetting to the terminal would
be inhibited.

Wish I knew more, perhaps Dhillman would find time to comment?

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Nutting
> Sent: Thursday, October 03, 2002 3:23 PM
> To: [log in to unmask]
> Subject: [TN] soldering brass to copper
>
>
> I vaguely remember something about soldering brass in some
> recent posts.  We are looking at some cooling parts that may
> require soldering brass to copper.  My experience says that
> this is a non-problem.  The posts that I remember said
> something about tin and crystallization.  Am I mixing two
> different thoughts here?
>
> Phil Nutting
> Manufacturing Engineer
> Kaiser Systems, Inc.
> voice: 978-922-9300
> e-mail: [log in to unmask]
>
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