Also,
Make sure that your lead lengths are not too long allowing the component
leads to
Hit the nozzles baffles causing the parts to be knocked up out of place.
Or that your chip wave (if used) is not to high causing a problem.
I have also seen (in some case's) where insufficient flux can also cause
Raised components. Mainly in small header connectors and such.

Barry.

 -----Original Message-----
From:   Richard Carruth [mailto:[log in to unmask]]
Sent:   Tuesday, October 29, 2002 1:05 PM
To:     [log in to unmask]
Subject:        Re: [TN] Raised TH components after Wave

Peter,

Make sure your PCA is not to deep in the solder wave. Immersion depth should
typically be 50% of PWB thickness with your dwell time around 3 sec.
depending
on board type and design. Your contact length should be about 2 inches. We
use a
Wave Solder Optimizer to control such parameters.

Best of Luck
Richard Carruth
Quality Eng.
LaBarge Inc.
Ph# 918-459-2346




[log in to unmask] on 10/29/2002 02:02:25 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
to
      [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Richard Carruth/LABARGE)

Subject:  [TN] Raised TH components after Wave



Hi all,

We are experiencing a large number connecters and / or sockets that are
raised after the Wave Solder process.

We classify a raised part as any gap between the PBC and the component even
though we are still keeping with IPC's standard of lead length.  Is our
defect classification overkill?

If not, does anyone have this problem and can suggest a remedy?


Peter Crain
Manufacturing Engineering Technologist

Substation Automation Solutions
General Electric Canada Inc.
2728 Hopewell Place N.E., Calgary, Alberta T1Y 7J7  CANADA

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