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October 2002

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Subject:
From:
"Jason W. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 29 Oct 2002 17:04:34 -0600
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If you are running significant volumes, you might try using pallets with
topsides supports. We used them in a previous life. We had certain connectors,
sockets, and such that "rode up" during wave and we bought some dura-stone type
material pallets that used arms that hinged down on these pesky parts.

Jason Gregory
Production Supervisor
LaBarge Inc.
(918)459-2367
[log in to unmask]





[log in to unmask] on 10/29/2002 02:02:25 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
      [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Jason Gregory/LABARGE)

Subject:  [TN] Raised TH components after Wave



Hi all,

We are experiencing a large number connecters and / or sockets that are
raised after the Wave Solder process.

We classify a raised part as any gap between the PBC and the component even
though we are still keeping with IPC's standard of lead length.  Is our
defect classification overkill?

If not, does anyone have this problem and can suggest a remedy?


Peter Crain
Manufacturing Engineering Technologist

Substation Automation Solutions
General Electric Canada Inc.
2728 Hopewell Place N.E., Calgary, Alberta T1Y 7J7  CANADA

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