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October 2002

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Subject:
From:
"Bailey, Beth A. (AMHERST)" <[log in to unmask]>
Reply To:
Bailey, Beth A. (AMHERST)
Date:
Tue, 29 Oct 2002 15:44:15 -0500
Content-Type:
text/plain
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text/plain (64 lines)
In the past, we have used an adhesive (made by Loctite) dispensed in a very
small quantity at the corners of the sockets or connectors.  Once cured, it
holds the component in place and does not need to removed after wave.

 Beth A. Bailey
 Manufacturing - Trainer
 Northrop Grumman Corporation
 Electronic Systems
 Amherst Systems
 30 Wilson Road
 Buffalo, NY  14221


-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Tuesday, October 29, 2002 3:02 PM
To: [log in to unmask]
Subject: [TN] Raised TH components after Wave


Hi all,

We are experiencing a large number connecters and / or sockets that are
raised after the Wave Solder process.

We classify a raised part as any gap between the PBC and the component even
though we are still keeping with IPC's standard of lead length.  Is our
defect classification overkill?

If not, does anyone have this problem and can suggest a remedy?


Peter Crain
Manufacturing Engineering Technologist

Substation Automation Solutions
General Electric Canada Inc.
2728 Hopewell Place N.E., Calgary, Alberta T1Y 7J7  CANADA

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