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October 2002

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Subject:
From:
Chad Haima <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 29 Oct 2002 12:18:49 -0800
Content-Type:
text/plain
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text/plain (67 lines)
Peter,
I seem to remember an IPC standard of an allowable clearance between
component and PCB so perhaps your classification is overkill.  Help
fellow technetters.  As a manufacturer of custom tooling a solder
fixture would curtail your dilemma if there is one.  I've also seen
usage of independent weighted objects like bean bags or in Canada I've
even seen modified hockey pucks.

Chad Haima
Pentagon EMS
503-924-2747

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of
[log in to unmask]
Sent: Tuesday, October 29, 2002 12:02 PM
To: [log in to unmask]
Subject: [TN] Raised TH components after Wave

Hi all,

We are experiencing a large number connecters and / or sockets that are
raised after the Wave Solder process.

We classify a raised part as any gap between the PBC and the component
even
though we are still keeping with IPC's standard of lead length.  Is our
defect classification overkill?

If not, does anyone have this problem and can suggest a remedy?


Peter Crain
Manufacturing Engineering Technologist

Substation Automation Solutions
General Electric Canada Inc.
2728 Hopewell Place N.E., Calgary, Alberta T1Y 7J7  CANADA

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